AT EVERY LEVEL
A packaging execution system that provides quick and easy identification, serialization and aggregation on even the most demanding packaging lines.
Learn moreStreamline your manufacturing operations with our all-in-one solution
Learn moreImplement our best-in-class placement solutions for any mix, any volume, any time smart manufacturing
Learn moreRadial insertion machine for products with very high component density. With guide pin technology unique to Panasonic.
Learn moreRL142: the radial insertion machine for the shortest tact times
Learn moreMarket-leading odd shape placement machine. NPM-VF can place radial, axial components in addition to standard SMT components. Components from Tray in Bulk or stick can also be mounted on this machine.
Learn moreMarket-leading odd shape placement machine. NPM-VF can place radial, axial components in addition to standard SMT components. Components from Tray in Bulk or stick can also be mounted on this machine.
Learn morePGMA helps to expand our Smart Factory approach to your final assembly areas, where even manual processes may still be commonly used. In these areas high failure rates and a low level of traceability are weak points in several production floors.
Learn moreIncrease efficiency with an integrated robot & welding solution, all from one manufacturer using a common CPU.
Learn moreEnjoy seamless interfacing between process and automation components.
Learn moreWork flexibly with a modular concept, turnkey and universally usable solution.
Learn moreInspect welding seams to maintain quality
Learn moreOur integrated Line Controller offers possibility to integrate with 3rd party equipment in the line. Perform autochangeover through the whole line, collect and export production data
Learn moreEnjoy a range of functions, including Material Control, Traceability, Production Analysis, Production Monitoring and Dispatch, Production Planning, Material Verification, Maintenance, Product Changeover and Control, and Data Linking.
Learn moreFor plasma cleaning of wafers and substrates
Learn moreFor high-quality ultrasonic flip-chip bonding of bare ICs.
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